CAM Colloquium: Jason Grenier (Corning, Inc.) - Applications of ultrafast laser material processing

Location

Frank H. T. Rhodes Hall 655

Description

Abstract: Ultrafast lasers have opened a new realm of opportunities for material processing, particularly within transparent dielectric materials, that have had broad impact across many fields including telecommunications, semiconductor manufacturing, biophotonics, and industrial laser processing. Focusing ultrafast laser pulses inside transparent materials leads to strong nonlinear effects that evolve on record short time scales and enable a three-dimensional fabrication technique with minimal to no heat affected area and spatial resolution that can exceed the diffraction limit of light. Understanding and controlling such complex phenomena is a major scientific challenge, one that requires a deep understanding of physics and mathematics in order to favorably manipulate such nonlinear processes into reliable manufacturing methods. This presentation will overview several research and industrial applications of ultrafast laser processing and introduce some of the underlying mathematics in order to convey the need and opportunities for applied mathematicians in these areas. Bio: Jason R. Grenier received the BASc. and MASc. degrees in Electrical Engineering from the University of Waterloo. He earned a PhD (2016) degree in the Department of Electrical and Computer Engineering at the University of Toronto where he pioneered the fabrication of ultrafast laser written optical circuits inside of optical fibers. He then joined the University of California at Davis as a postdoctoral scholar where he developed the ultrafast laser 3D fabrication of large scale optical phased arrays for non-mechanical beam-steering of near-, mid-, and long-wave infrared radiation. Dr. Grenier is currently with the Laser Processing and Engineering team at the Corning Inc. Sullivan Park Research & Development Campus in Corning, New York, where he participates in the research and development of novel laser processing.